Moving Test Data Faster

Moving Test Data Faster

🎙 Semiconductor Engineering 👥 30K 📅 September 16, 2026 ⏱ 11 min 👁 12 📄 expert opinion 🧭 2026-09-16
Available in: English (current) Français

Keywords

test datamulti-chipletIEEE 1838scan testFPP

Summary

The video features an interview with Vidya Neerkundar, Director of DFT Product Management at Siemens EDA’s Tessent Division, discussing the challenges of moving test data in increasingly complex multi-chiplet designs. As designs incorporate more chiplets, the volume of test data grows significantly, including logic, memory, and debug data. The IEEE 1838 standard defines PTAP (Primary Test Access Port) and STAP (Secondary Test Access Port) for serial access, which is slow due to the TCK clock rate. To accelerate data transfer, the Flexible Parallel Port (FPP) allows parallel data transmission, and Siemens’ Tessent Streaming Scan Network (SSN) implements an FPP that can send data through the entire stack of chiplets. SSN also supports high-bandwidth IJTAG (IEEE 1687) for testing memories and logic. The discussion covers trade-offs between FPP and serial access, emphasizing the need to plan test architectures upfront. Die-to-die interconnects, such as TSVs and substrates, require dedicated test methods including loopback testing (short and foreign) to detect defects at the package level. In-field testing is highlighted as a growing need, utilizing either stored patterns via FPP or BIST-based approaches. Finally, IEEE 1149.1 is mentioned as a long-standing standard for board-level testing, now being adapted for multi-die systems by extracting boundary scan definitions.

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Critical Evaluation

Value of the Information & Strength of the Argument

The information is highly valuable for semiconductor engineers and DFT specialists because it provides a clear, expert explanation of how test data movement is handled in advanced multi-chiplet packages. The argumentation is logical and well-structured: Vidya systematically explains the limitations of serial access (PTAP/STAP), introduces the FPP/SSN as a high-bandwidth solution, and details how IJTAG extends support to memory and debug. She also addresses practical considerations such as loopback testing, die-to-die interconnects, and in-field testing, always grounding her claims in established IEEE standards and real engineering practice. The discussion is not overly promotional; it focuses on the technical merits and trade-offs of each approach, making it a solid source of information for understanding current test methodologies.

Scientific Rigor, Source Quality, Title Accuracy

The scientific rigor of the video is high: it cites several IEEE standards (1838, 1687, 1149.1, 1500) and covers established DFT concepts like scan ATPG, BIST, and loopback testing. The quality of sources is good, though the video does not reference specific papers or external URLs; it relies on the speaker’s expertise and the mention of standards. The title ‘Moving Test Data Faster’ accurately captures the core theme, and there is a one-to-one correspondence between the title and the content discussed. Adequation between title and content is excellent; the video stays focused on test data movement and does not drift beyond this scope.

234 words

Title / Content Match

The title accurately reflects the content, which focuses on methods to accelerate test data movement in multi-chiplet designs.

Quality & Reliability

8/10

The video presents a detailed technical discussion by a domain expert, covering established IEEE standards and practical engineering approaches. No contradictions or questionable claims detected.

Key Moments

Contribution & Novelties

The video provides an expert overview of advanced test data movement techniques in multi-chiplet semiconductor designs, specifically focusing on the implementation of IEEE 1838 and the use of streaming scan networks to overcome serial bottlenecks. It clarifies the trade-offs between serial and parallel access, introduces loopback techniques for die-edge testing, and outlines how in-field testing leverages existing infrastructure. The original contribution lies in framing these methods within a coherent engineering workflow, bridging academic standards and practical DFT deployment.

Pour aller plus loin :

  • IEEE 1149.1 (JTAG) on Wikipedia — Background on the foundational board-level test standard discussed in the video.
  • IEEE 1687 (IJTAG) on Wikipedia — Details on the internal JTAG standard used for accessing instrumentation.
  • Built-in self-test on Wikipedia — Overview of BIST methods relevant to logic and memory tests mentioned in the context of in-field test.

138 words

Radar Profile

The radar profile shows a video with strong technical depth (niveau_technique 9) and high information quality (quantite_information 8, qualite_information 8), but slightly lower scores in overall reliability (fiabilite_globale 8). This indicates a well-argued, expert-level discussion that could benefit from additional external references to further consolidate its authority.

Reliability 8/10