Electronic devices and materials

Lec 24: Multi - Domain VA & OBC Mode

Lec 23: Vertical Alignment Mode: Dynamics & Overdrive

Lec 22: In - Plane switching Mode

Lec 21: Transmissive Liquid Crystal Displays

China Just Built What ASML Feared Most

The 1-Nanometer Barrier Just Fell

Josephson Junction and Superconducting Quantum Circuit Fabrication Process

#55: CHASSIS - Europäische Chiplet-Initiative, Emissionen in der Halbleiterproduktion, ALLOS Semi...

#55: CHASSIS - European Chiplet Initiative, Emissions in Semiconductor Production, ALLOS Semi...

#43: Neue Halbleiterkrise? Nexperia Updates; Brains on Silicon - Review; Neue Chips: Europa von A...

#43: New Semiconductor Crisis? Nexperia Updates; Brains on Silicon - Review; New Chips: Europe from A...

Silicon Is Over. Meet Its Successor

The Thermodynamic AI Chip · Thomas Ahle

The Lab That Decides Which Chip Technologies the World Actually Builds

China Just Built What TSMC Said Was Impossible

They Just Shrunk AI Data Center by 10,000x

BJT Part2: Base width modulation, High Level Injection, Breakdown, Circuit Models | 2026 L13

Advanced CMOS Scaling: FinFET to GAA and CFET | 2026 L14

BJT Part1: NPN Operation, Minority Carrier Distribution & What Controls Current Gain | 2026 L12

Tearing Apart An X-Ray Machine - Nuclear Engineer Reacts to NileRed

MOSFET Part 2: Basic Operations and Key Advanced Concepts| 2026 L11

Cette nouvelle technologie pourrait tuer TSMC et ASML.

This new technology could kill TSMC and ASML.

The Terrifying Truth About TSMC's New Chips

MOSFET Part 1: Band Diagrams, Threshold Voltage, C–V | 2026 L10

Diode Current, Contacts & the Road to MOSFET: PN Current, Ohmic vs Schottky & MOS Capacitor | 2026L9

The Breakthrough Terrifying ASML

System-in-Package Challenges

Next Step in Semiconductor at Purdue

PN Junction : Built-In Potential, Depletion Width, Reverse Bias, Breakdown, Diode Current | 2026L8

Why More CPUs Are Needed In Data Centers

New Chip Factory That Terrifies TSMC

Literally Everything About How Computer Chips Are Made Explained Slowly (For Sleep)

Excess Carriers, Recombination, PN Junction: From Ambipolar Transport to Interface Trapping | 2026L7

Qu'est-ce qu'il y a vraiment dans une carte bancaire ? | C'est Technique

What's really inside a bank card? | It's Technical

Huge Chip Breakthrough — and A Massive Warning For TSMC

Memory For AI At The Edge

Advanced Semiconductor Packaging Explained: Hybrid Bonding, Chiplets & Manufacturing Innovation

From Crystal to Quantum Tunneling: Why We Need Quantum Mechanics for Modern Transistors | 2026 L3

Bosch Mega Factory: Inside One of Europe’s Most Advanced Chip Plants | FD Engineering

Symbiotic Relationship Between AI and Semiconductors

From FinFET to CFET: Semiconductor Roadmap, Materials & Device Junctions | 2026 L2

Semiconductor From Transistors to Trillions: Course Intro, MOSFETs, Moore's Law | 2026 L1